Sealants for Potting and Encapsulation
Hernon Manufacturing epoxies, silicones, and polyurethanes are used for potting and encapsulation. The high chemical, impact, and temperature resistance of epoxies make them ideal for protecting sensitive electronics. Hernon Manufacturing potting materials start out as low-viscosity self-leveling liquids that quickly fill gaps in and around components. Cured results can vary widely including rigid, opaque compounds or clear, flexible compounds as needed to meet manufacturing specs.
All Hernon Manufacturing potting materials are 100% solid systems with NO solvents. Curing for different formulas can be initiated using heat via the Hernon Manufacturing UV LED curing lights or anaerobically with the available low exotherm formulas. The Hernon Manufacturing full-service lab offers substrate thermal expansion matching and pulls from an active library of over 5000 different adhesive and sealant formulas to ensure strong adhesion to most substrates including composite materials.
Significant Features and Key Advantages of Hernon Manufacturing Potting Epoxies:
- Bonds to a wide variety of substrates
- High impact, shock, and vibration resistance
- 100% Solid System with NO solvents
- Custom formulas are available to match thermal expansion rates of substrates
- Thermal cycling tolerance (temperature stable)
- Environmental resistance
- Electrically insulating formulas are available
- Resists corrosion
- Clear, opaque, and color versions are available
- Scan barcodes through clear epoxies
- Secure components against tampering
- Waterproof sensors and power sources
- Low viscosity self-leveling fill material
- Fast room temperature curing or low exotherm curing is available
Silastomer® 343 is a high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Designed to provide excellent oil resistance and can be used as a form in place gasket.
Tuffbond® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudspeakers. Tuffbond® 302 is also recommended for bonding metals, wood, ceramics, etc.,
Tuffbond® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.
Tuffbond® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent resistance.
Tuffbond® 321 is a flexible, low viscosity, general purpose resin system used for casting, potting, and encapsulating of electrical and electronic components. This unique product has been formulated to combine ease in handling with optimum physical, thermal and electrical insulation properties.
Ultrabond® Sealant 721 is a UV curable adhesive that can be used to seal a variety of plastics when exposed to UV light. The sealant offers a water- tight seal with excellent environmental resistance. Prevents material escaping through a crimped seal. With Ultrabond® Sealant 721 a low powered UV lamp (Blacklight), can be used to inspect for the presence of adhesive on the substrates.
