Solder Paste Features & Benefits

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space.

No-clean solder paste is by far the most prevalent solder paste in modern electronic manufacturing, but there is still a purpose and a fit for water-soluble and RMA solder paste as well. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes – coupled with our world-renowned technical support – allow for the lowest total cost of ownership and fewer end-of-line defects.

No-Clean

  • Indium8.9HF Best all-around halogen-free paste
  • Indium8.9HF1 Enables in-circuit probe testing
  • Indium8.9HFA Superior printing for miniaturization
  • Indium 10.8HF Addresses non-wet opens (NWOs)
  • Indium10.1 Best all-around halogen-containing solder paste
  • Indium8.9HF (Pb) Best all-around halogen-free paste
  • Indium8.9ES (Pb) Excellent print transfer efficiency for the broadest range of processes
  • NC-SMQ92H (Pb) Modified version of NC-SMQ92J that maximizes print performance
  • NC-SMQ92J (Pb) Industry-leading solder paste with a soft residue that reduces false failures at ICT
  • NC-SMQ51SC (Pb) Exceptional stencil life and tack strength, and consistent print definition in ultra-fine pitch applications

Water Soluble

  • Indium3.2 Industry-tested quality and reliability
  • Indium3.2HF Halogen-free solder paste with similar performance to Indium3.2
  • Indium6.6HF Versatile option for water-wash processes
  • Indium6.4R Superior wetting to a variety of surface finishes

Low-Temperature

  • Indium5.7LT-1 A low-temperature, Pb-free solder paste designed for assembly processes using Bi-based and In-based low-temperature alloys
  • NC-SMQ80 An InSn solder paste specially designed for low temperature applications that   need high mechanical reliability
  • Durafuse™ LT Is a novel solder paste mixed-alloy system for low-temperature reflow processes which require high drop shock reliability